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Intel and Lens Tech Sign MOU to Develop Advanced TGV Glass Substrates
Lens International (Hong Kong) Co., Ltd., a subsidiary of Lens Technology, has officially entered into a Memorandum of Understanding (MOU) with Intel Corporation to advance semiconductor packaging technology. This strat…
ASML Raises 2026 Guidance as Semiconductor Equipment Cycle Peaks
The semiconductor industry is signaling a robust recovery as ASML, the world's leading provider of lithography systems, raised its FY2026 earnings guidance for the second time in just three months. Following the company…